Monolithic Copper
Cold Plates
Built for Kilowatt-Class AI
Why sintering beats brazing — every time.
Traditional cold plates are assembled from multiple machined pieces, joined by brazing or soldering. Every joint is a failure mode. Every interface adds thermal resistance. Sinterform eliminates both.
Sintered Copper
- Monolithic structure Powder compacted and sintered into one piece — no assembly
- Zero joint interfaces Eliminates the #1 source of delamination and thermal degradation
- Complex internal channels Near-net-shape forming allows microchannel geometries impossible with machining
- Superior thermal contact Sintered copper achieves >99% theoretical density at the heat-transfer surface
- Consistent lead times Powder-to-plate process scales without tooling changes — 6 weeks typical
Brazed / Machined
- Multi-piece assembly Header, base plate, fin stack — each with its own tolerances and failure modes
- Brazed filler interfaces Each joint adds 0.1–0.3 °C·cm²/W contact resistance under load
- Geometry limited by tooling Straight channels only — complex flow paths require costly EDM or additive steps
- Cyclic delamination risk Thermal cycling stresses brazed joints — field failures common in 2,000+ hr operation
- Long lead times Custom tooling setup, multiple sub-assembly suppliers — 12–24 weeks typical
Numbers that matter to thermal engineers.
30%+
Lower Thermal Resistance
vs. brazed copper cold plates at equivalent flow rates
1 kW+
GPU Power Handling
Proven at full H100 SXM and B200 TDP with margin
99.7%
Copper Density
Near-theoretical density at heat-transfer surface — no voids
6 wk
Sample Lead Time
From design file to qualified engineering sample
Direct Copper Contact
Sinterform plates bond directly to the GPU heat spreader with no intermediate thermal interface material gaps. The sintered structure wicks TIM uniformly and holds contact pressure through 10,000+ thermal cycles without joint creep.
Complex Flow Geometries
Near-net-shape sintering forms microchannel arrays, turbulence promoters, and graduated fin densities in a single part. Hotspot-targeted flow distribution is a design parameter — not an afterthought. Optimized CFD simulations guide powder die design before a single gram of copper is pressed.
From copper powder to cold plate — no assembly required.
Thermal Design
Your GPU layout, TDP targets, and flow constraints drive the channel geometry. CFD simulation validates pressure drop and hotspot coverage before tooling.
Powder Compaction
High-purity copper powder is die-pressed at precise pressures — forming the near-net-shape plate with internal channel voids in a single press cycle.
Sintering
The green compact is sintered in a controlled atmosphere furnace, diffusion-bonding powder particles into a fully dense, monolithic copper structure.
CNC Finishing
Critical mating surfaces — port threads, GPU contact faces, mounting bosses — are machined to final tolerance. No brazing. No assembly. One piece, done.
No tooling changes needed between geometries.
Different GPU layouts use different die inserts — not different production lines. Design iterations are fast and low-cost.
Designed for the hardest cooling problems in AI.
Sinterform cold plates are spec-designed around NVIDIA GPU form factors — with the geometric flexibility to support any architecture that follows.
H100 SXM
- Dual-port manifold
- Optimized fin pitch for SXM carrier
- NVLink-clearance geometry
B200 / GB200
- 1.2 kW cooling capacity
- Matched NVLink connector zones
- Low-profile plate for NVL72 rack
Custom OEM
- Full geometry customization
- CFD-optimized per spec
- Qualification support included
"Traditional cold plate suppliers — Boyd, Mikros, Wieland — all use the same brazed multi-piece construction they've shipped for 20 years. Sinterform is the first to apply powder metallurgy at scale to liquid cooling."
Sinterform Engineering Team
Ready to eliminate your thermal bottleneck?
Share your GPU layout and TDP targets. Our thermal engineers will review your design and propose a Sinterform cold plate geometry — no obligation, no sales calls, just engineering.